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 WFF7N60
Silicon N-Channel MOSFET
Features
7A,600V,RDS(on)(Max 1.0)@VGS=10V Ultra-low Gate Charge(Typical 29nC) Fast Switching Capability 100%Avalanche Tested Isolation Voltage(VISO=4000V AC) Maximum Junction Temperature Range(150)
General Description
This Power MOSFET is produced using Winsemi's advanced planar stripe,VDMOS technology. This latest technology has been especially designed to minimize on -state resistance,have a high rugged avalanche characteristics. This devices is specially well suited for half bridge and full bridge resonant topology line a electronic lamp ballast,high efficiency switched mode power supplies, active power factor correction.
Absolute Maximum Ratings
Symbol
VDSS ID Continuous Drain Current(@Tc=100) IDM VGS EAS EAR dv/dt PD Derating Factor above 25 TJ,Tstg TL Junction and Storage Temperature Channel Temperature 0.38 -55~150 300 W/ Drain Current Pulsed Gate to Source Voltage Single Pulsed Avalanche Energy Repetitive Avalanche Energy Peak Diode Recovery dv /dt Total Power Dissipation(@Tc=25) (Note2) (Note1) (Note3) (Note1) 4.1* 26 30 240 15 4.5 48 A A V mJ mJ V/ ns W Drain Source Voltage Continuous Drain Current(@Tc=25)
Parameter
Value
600 7*
Units
V A
*Drain current limited by junction temperature Thermal Characteristics
Symbol
RQJC RQJA
Parameter
Thermal Resistance , Junction -to -Case Thermal Resistance , Junction-to -Ambient
Value Min
-
Typ
-
Max
2.6 62.5
Units
/W /W
Rev.A Sep.2010
Copyright@WinSemi Semiconductor Co., Ltd., All right reserved.
WFF7N60
Electrical Characteristics(Tc=25)
Characteristics
Gate leakage current Gate-source breakdown voltage
Symbol
IGSS V(BR)GSS
Test Condition
VGS=30V,VDS=0V IG=10 A,VDS=0V VDS=600V,VGS=0V
Min
30 600 2 -
Type
-
Max
100 10 100
Unit
nA V A A V V S
Drain cut -off current
IDSS VDS=480V,Tc=125
Drain -source breakdown voltage Gate threshold voltage Drain -source ON resistance Forward Transconductance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-on time Switching time Fall time Turn-off time Total gate charge(gate-source
V(BR)DSS VGS(th) RDS(ON) gfs Ciss Crss Coss tr ton tf toff
ID=250 A,VGS=0V VDS=10V,ID=250 A VGS=10V,ID=3.5A VDS=50V,ID=3.5A VDS=25V, VGS=0V, f=1MHz VDD=200V, ID=7.0A RG=25 (Note4,5) VDD=480V,
0.8 8.7 1100 135 16 30 80 65 60 29 7 14.5
4 1.0 1430 175 21 70 170
pF
ns 140 130 38 nC -
-
Qg plus gate-drain) Gate-source charge Gate-drain("miller") Charge Qgs Qgd VGS=10V, ID=7.0A (Note4,5)
-
Source-Drain Ratings and Characteristics(Ta=25)
Characteristics
Continuous drain reverse current Pulse drain reverse current Forward voltage(diode) Reverse recovery time Reverse recovery charge
Symbol
IDR IDRP VDSF trr Qrr
Test Condition
IDR=7.4A,VGS=0V IDR=7.4A,VGS=0V, dIDR / dt =100 A / s
Min
-
Type
320 2.4
Max
7.0 28 1.4 -
Unit
A A V ns C
Note 1.Repeativity rating :pulse width limited by junction temperature 2.L=18.5mH IAS=7A,VDD=50V,RG=0 ,Starting TJ=25 3.ISD7.0A,di/dt200A/us,VDD2/7
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WFF7N60
Fig.1 On-State Characteristics
Fig.2 Transfer Current characteristics
Fig.3 On Resistance variation vs Drain Current
Fig.4 Body Diode Forward Voltage Variation with Source Current and temperature
Fig.5 On-Resistance Variation vs Junction Temperature
Fig.6 Gate Charge Characteristics
3/7
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WFF7N60
Fig.7 Maximum Safe Operation Area
Fig.8 Maximum Drain Current vs Case Temperature
Fig.9 Transient Thermal Response curve
4/7
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WFF7N60
Fig.10 Gate Test circuit & Waveform
Fig.11 Resistive Switching Test Circuit & Waveform
Fig.12 Uncamped Inductive Switching Test Circuit & Waveform
5/7
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WFF7N60
Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform
6/7
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WFF7N60
TO-220F Package Dimension
Unit:mm
7/7
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